{"title":"3D打印电路模型的高频阻抗","authors":"Martin Ralchev, V. Mateev, I. Marinova","doi":"10.1109/BulEF56479.2022.10021179","DOIUrl":null,"url":null,"abstract":"This work presents 3D printing of passive electronic elements for printed circuit board integration, using the Fused Filament Fabrication (FFF) technology. 3D printing is an innovative method that can be applied to produce volumetric printed circuit boards and ease the manufacturing, deploying, assembly and connecting processes. This paper shows the standard steps in the printed circuit board manufacturing process and how it can be facilitated by 3D printing technology. Capabilities of existing 3D printing polymer FFF materials as electrically conductive, insolative and magnetically permeable are explored. 3D printing technology features in the process of manufacturing printed circuit board passive elements are presented. Electric impedance parameters of printed models of electric wire traces, inductors and bulk capacitor are measured in the frequency band up to 100kHz.","PeriodicalId":375606,"journal":{"name":"2022 14th Electrical Engineering Faculty Conference (BulEF)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High Frequency Impedance of 3D Printed Electric Circuit Models\",\"authors\":\"Martin Ralchev, V. Mateev, I. Marinova\",\"doi\":\"10.1109/BulEF56479.2022.10021179\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work presents 3D printing of passive electronic elements for printed circuit board integration, using the Fused Filament Fabrication (FFF) technology. 3D printing is an innovative method that can be applied to produce volumetric printed circuit boards and ease the manufacturing, deploying, assembly and connecting processes. This paper shows the standard steps in the printed circuit board manufacturing process and how it can be facilitated by 3D printing technology. Capabilities of existing 3D printing polymer FFF materials as electrically conductive, insolative and magnetically permeable are explored. 3D printing technology features in the process of manufacturing printed circuit board passive elements are presented. Electric impedance parameters of printed models of electric wire traces, inductors and bulk capacitor are measured in the frequency band up to 100kHz.\",\"PeriodicalId\":375606,\"journal\":{\"name\":\"2022 14th Electrical Engineering Faculty Conference (BulEF)\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-09-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 14th Electrical Engineering Faculty Conference (BulEF)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/BulEF56479.2022.10021179\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 14th Electrical Engineering Faculty Conference (BulEF)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BulEF56479.2022.10021179","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High Frequency Impedance of 3D Printed Electric Circuit Models
This work presents 3D printing of passive electronic elements for printed circuit board integration, using the Fused Filament Fabrication (FFF) technology. 3D printing is an innovative method that can be applied to produce volumetric printed circuit boards and ease the manufacturing, deploying, assembly and connecting processes. This paper shows the standard steps in the printed circuit board manufacturing process and how it can be facilitated by 3D printing technology. Capabilities of existing 3D printing polymer FFF materials as electrically conductive, insolative and magnetically permeable are explored. 3D printing technology features in the process of manufacturing printed circuit board passive elements are presented. Electric impedance parameters of printed models of electric wire traces, inductors and bulk capacitor are measured in the frequency band up to 100kHz.
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