{"title":"用于无碰撞互连和晶圆对晶圆集成的新型胶粘剂设计与评价","authors":"S. Maetani, N. Araki, Y. Kim, S. Kodama, T. Ohba","doi":"10.23919/ICEP.2019.8733438","DOIUrl":null,"url":null,"abstract":"The material viscosities of permanent and temporary adhesives were examined using the rigid body pendulum method to reveal a suitable for the wafer bonding process at 100 °C. Properties suited for the debonding process The adhesive is applied to wafer-on-wafer (WOW) stacking with bumpless dual-damascene interconnect (via-last after bonding) technology, which enables multilevel stacking using ultra-thin wafers of several micrometers or less at low cost.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"New Adhesive Design and Evaluation for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration\",\"authors\":\"S. Maetani, N. Araki, Y. Kim, S. Kodama, T. Ohba\",\"doi\":\"10.23919/ICEP.2019.8733438\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The material viscosities of permanent and temporary adhesives were examined using the rigid body pendulum method to reveal a suitable for the wafer bonding process at 100 °C. Properties suited for the debonding process The adhesive is applied to wafer-on-wafer (WOW) stacking with bumpless dual-damascene interconnect (via-last after bonding) technology, which enables multilevel stacking using ultra-thin wafers of several micrometers or less at low cost.\",\"PeriodicalId\":213025,\"journal\":{\"name\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP.2019.8733438\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733438","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New Adhesive Design and Evaluation for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration
The material viscosities of permanent and temporary adhesives were examined using the rigid body pendulum method to reveal a suitable for the wafer bonding process at 100 °C. Properties suited for the debonding process The adhesive is applied to wafer-on-wafer (WOW) stacking with bumpless dual-damascene interconnect (via-last after bonding) technology, which enables multilevel stacking using ultra-thin wafers of several micrometers or less at low cost.