二维电子板的热分析

InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88 Pub Date : 1988-05-11 DOI:10.1109/ITHERM.1988.28681

S. C. Yao, K. Su

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引用次数: 5

摘要

建立了一套计算机程序，对不等高二维电子板的热性能进行了计算。考虑了对流、传导和辐射传热的细节。在一个由70个元件组成的7列板上的风洞中进行了实验。拍摄了不同流量条件下的热红外图像。计算结果与实验数据吻合较好。一些关键的，但尚未解决的问题，关于热传递的引脚和在板的背面也进行了讨论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal analysis of a two-dimensional electronic board

A computer program has been established to evaluate the thermal performance of two-dimensional electronic boards with elements of unequal heights. Details of convective, conductive, and radiative heat transfer are considered. Experiments have been performed in a wind tunnel on a board of 70 elements arranged in 7 columns. Thermal infrared pictures at various flow conditions are taken. The computed results agree well with the experimental data. Some critical but unresolved questions regarding the heat transfer on the pins and at the back side of the board are also discussed.<>

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InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88

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