一种线性度改进的红外平面放大器TDI CMOS读出电路

Zhang Ya-cong, Liu Dan, Lu Wengao, Chen Zhongjian, Ji Lijiu, Zhao Baoying
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引用次数: 4

摘要

提出了一种适用于CMOS技术的时延集成(TDI)模式红外焦平面阵列读出集成电路(ROIC)。单元输入级采用开关电流集成(SCI)结构和简单的线性度改进电路实现。从单元格流出的电流通过开关阵列定向到离像素集成电容器。不同探测器对同一图像像素的信号存储在同一电容上,实现求和功能。电容器上的电压信号通过相关双采样级后依次读出。该电路还实现了缺陷像素校正。仿真结果表明,TDI函数实现正确,线性度从96.15%提高到97.70%(不含共输出级),但功耗略有增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A TDI CMOS Readout Circuit for IRFPA with Linearity Improvement
This paper presents a readout integrated circuit (ROIC) for infrared focal plane array (IRFPA) with time delay and integration (TDI) mode suitable for CMOS technology. The unit-cell input stage is implemented with switch current integration (SCI) structure with a simple linearity improvement circuit. The current flowing out of the unit-cell is directed to the off-pixel integration capacitors through a switch array. The signals from different detectors for the same image pixel are stored on the same capacitor, implementing the summation function. The voltage signals on capacitors are read out serially after they pass through the correlated double sample stage. Defective pixel correction is also implemented in this circuit. The simulation results show that the TDI function is correctly implemented and the linearity is improved from 96.15% to 97.70% (without the common output stage) at the expense of a little increase of power dissipation.
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