{"title":"基于PC的模拟/数字CMOS/DMOS/双极/智能功率阵列CAD系统","authors":"P. Chatterjee, C. M. Brown, M. W. van der Kooi","doi":"10.1109/ASIC.1990.186164","DOIUrl":null,"url":null,"abstract":"A CAD system incorporating schematic capture, analog simulation, digital simulation, and layout utilizing a PC workstation platform is described. The single-layer metal programmable array consists of a CMOS logic core, an analog CMOS core, high-voltage DMOS FETs, bipolar devices, and interface devices. This combination of components and their applications presented various design constraints to incorporate into a single CAD system.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A PC based CAD system for an analog/digital CMOS/DMOS/bipolar/smart power array\",\"authors\":\"P. Chatterjee, C. M. Brown, M. W. van der Kooi\",\"doi\":\"10.1109/ASIC.1990.186164\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A CAD system incorporating schematic capture, analog simulation, digital simulation, and layout utilizing a PC workstation platform is described. The single-layer metal programmable array consists of a CMOS logic core, an analog CMOS core, high-voltage DMOS FETs, bipolar devices, and interface devices. This combination of components and their applications presented various design constraints to incorporate into a single CAD system.<<ETX>>\",\"PeriodicalId\":126693,\"journal\":{\"name\":\"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-09-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASIC.1990.186164\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1990.186164","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A PC based CAD system for an analog/digital CMOS/DMOS/bipolar/smart power array
A CAD system incorporating schematic capture, analog simulation, digital simulation, and layout utilizing a PC workstation platform is described. The single-layer metal programmable array consists of a CMOS logic core, an analog CMOS core, high-voltage DMOS FETs, bipolar devices, and interface devices. This combination of components and their applications presented various design constraints to incorporate into a single CAD system.<>