SPAN:紧密耦合的热和电模拟

Proceedings of EURO-DAC 93 and EURO-VHDL 93- European Design Automation Conference Pub Date : 1993-09-20 DOI:10.1109/EURDAC.1993.410653

B. Klaassen, K. Paap

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引用次数: 1

摘要

提出了一种将常微分方程和偏微分方程求解器(如SPICE和ANSYS)相结合的方法，用于集成电路或系统的热电分析。本文给出了利用波形松弛的收敛原理的首个原型程序(SPAN)的草图和理论背景。该方法也可以扩展到机电仿真中更一般的问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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SPAN: Tightly coupled thermal and electrical simulation

A method is presented to combine solvers for ordinary and partial differential equations, like SPICE and ANSYS, for thermal-electrical analysis of integrated circuits or systems. A sketch of a first prototype program (SPAN) is given together with the theoretical background, which makes use of convergence principles from waveform relaxation. The approach can also be extended to more general problems within mechatronics simulation.<>

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来源期刊

Proceedings of EURO-DAC 93 and EURO-VHDL 93- European Design Automation Conference

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