高度灵活的AMOLED集成超薄单元触控面板

2016 IEEE Photonics Conference (IPC) Pub Date : 2016-10-01 DOI:10.1109/IPCON.2016.7831275

C. Lee, J. Ho, Kuang-Jung Chen, M. Yeh, Yuh‐Zheng Lee, Janglin Chen

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引用次数: 4

摘要

以聚酰亚胺(PI)为衬底，采用机械脱粘的方法，研究了柔性通用平面(FlexUP)技术。基于FlexUP技术，成功开发了弯曲半径为5mm的AMOLED，并采用新型结构的LTPS-TFT背板和超薄单元触控面板进行了演示。

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Highly flexible AMOLED integrated with ultrathin on-cell touch panel

The flexible universal plane (FlexUP) technology was demonstrated with Polyimide (PI) substrate and a mechanical debonding method. Based on FlexUP technology, the 5mm bending radius AMOLED is successfully developed and demonstrated with new structure LTPS-TFT backplane and ultrathin on-cell touch panel.

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2016 IEEE Photonics Conference (IPC)

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