{"title":"基于低成本多层叠层MCM技术的嵌入式电感设计与分析","authors":"R. Lee, Gye-an Lee, Mohamed Megahed","doi":"10.1109/EPEP.2003.1250005","DOIUrl":null,"url":null,"abstract":"The embedded inductor is designed and analyzed on low cost MCM laminate substrate based on RF measurement. Single layer and multilayer inductance library are developed on 4-layer MCM laminate substrate with 50/200/50 dielectric stack-up. Characterization process and modeling method are presented and analytical equations are provided. Process variation effect on inductor is also studied to identify the range of inductance variation according to the physical parameters of the embedded inductor. Area analysis is conducted for each configuration and single layer inductor is recommended for less than 8 nH inductance and two-layer inductor is recommended for more than 8 nH inductance.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"46 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Design and analysis of embedded inductor on low cost multilayer laminate MCM technology\",\"authors\":\"R. Lee, Gye-an Lee, Mohamed Megahed\",\"doi\":\"10.1109/EPEP.2003.1250005\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The embedded inductor is designed and analyzed on low cost MCM laminate substrate based on RF measurement. Single layer and multilayer inductance library are developed on 4-layer MCM laminate substrate with 50/200/50 dielectric stack-up. Characterization process and modeling method are presented and analytical equations are provided. Process variation effect on inductor is also studied to identify the range of inductance variation according to the physical parameters of the embedded inductor. Area analysis is conducted for each configuration and single layer inductor is recommended for less than 8 nH inductance and two-layer inductor is recommended for more than 8 nH inductance.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"46 4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250005\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250005","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design and analysis of embedded inductor on low cost multilayer laminate MCM technology
The embedded inductor is designed and analyzed on low cost MCM laminate substrate based on RF measurement. Single layer and multilayer inductance library are developed on 4-layer MCM laminate substrate with 50/200/50 dielectric stack-up. Characterization process and modeling method are presented and analytical equations are provided. Process variation effect on inductor is also studied to identify the range of inductance variation according to the physical parameters of the embedded inductor. Area analysis is conducted for each configuration and single layer inductor is recommended for less than 8 nH inductance and two-layer inductor is recommended for more than 8 nH inductance.
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