{"title":"封装高性能线圈的技术和热塑性塑料","authors":"James F. B. Patterson, J. Lang, M. Hozumi","doi":"10.1109/EEIC.1993.630950","DOIUrl":null,"url":null,"abstract":"Recent developments in thermoplastic encapsulation materials, molding techniques, and mold design for encapsulating high performance coils are reviewed. Recently developed encapsulation systems for UL 1446 Class F (155 C) and Class H (180 C) applications are discussed.","PeriodicalId":428411,"journal":{"name":"Proceedings of Electrical/Electronics Insulation Conference","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Techniques and thermoplastics for encapsulating high performance coils\",\"authors\":\"James F. B. Patterson, J. Lang, M. Hozumi\",\"doi\":\"10.1109/EEIC.1993.630950\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recent developments in thermoplastic encapsulation materials, molding techniques, and mold design for encapsulating high performance coils are reviewed. Recently developed encapsulation systems for UL 1446 Class F (155 C) and Class H (180 C) applications are discussed.\",\"PeriodicalId\":428411,\"journal\":{\"name\":\"Proceedings of Electrical/Electronics Insulation Conference\",\"volume\":\"96 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Electrical/Electronics Insulation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EEIC.1993.630950\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Electrical/Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EEIC.1993.630950","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Techniques and thermoplastics for encapsulating high performance coils
Recent developments in thermoplastic encapsulation materials, molding techniques, and mold design for encapsulating high performance coils are reviewed. Recently developed encapsulation systems for UL 1446 Class F (155 C) and Class H (180 C) applications are discussed.
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