亚5nm节点无结多纳米片场效应管的自热效应

Nitish Kumar, Kanyakumari Ashok Bhinge, Sushil Kumar, Samaresh Das, Ankur Gupta, Pushpapraj Singh
{"title":"亚5nm节点无结多纳米片场效应管的自热效应","authors":"Nitish Kumar, Kanyakumari Ashok Bhinge, Sushil Kumar, Samaresh Das, Ankur Gupta, Pushpapraj Singh","doi":"10.1109/ICEE56203.2022.10117830","DOIUrl":null,"url":null,"abstract":"In this paper, the self-heating effect (SHE) is investigated in single nanosheet to stacked multi-nanosheet channels using the 3D electrothermal module of the Sentaurus TCAD simulation tool. The non-uniform lattice temperature (TL) distribution is observed in the junctionless multi-nanosheet FET. The device performance is enhanced by ~5% when the nanosheet is stacked from a single to three nanosheets, but the maximum lattice temperature (TLmax) also increases by ~66.8 K. The ON-current degradation and TLmax do not only define the device's thermal stability. Therefore, the thermal resistance is obtained by the slope of ΔTLmax and DC power curves, which reflects the low thermal resistance in the multi-nanosheet device. Furthermore, the TLmax of junctionless and inversion mode devices is compared at the same operational power. It is found ~ 100 K lower in junctionless devices due to weak lateral electric field intensity at the channel/drain interface.","PeriodicalId":281727,"journal":{"name":"2022 IEEE International Conference on Emerging Electronics (ICEE)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Self-Heating Effect in Sub-5nm Node Junctionless Multi-Nanosheet FET\",\"authors\":\"Nitish Kumar, Kanyakumari Ashok Bhinge, Sushil Kumar, Samaresh Das, Ankur Gupta, Pushpapraj Singh\",\"doi\":\"10.1109/ICEE56203.2022.10117830\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the self-heating effect (SHE) is investigated in single nanosheet to stacked multi-nanosheet channels using the 3D electrothermal module of the Sentaurus TCAD simulation tool. The non-uniform lattice temperature (TL) distribution is observed in the junctionless multi-nanosheet FET. The device performance is enhanced by ~5% when the nanosheet is stacked from a single to three nanosheets, but the maximum lattice temperature (TLmax) also increases by ~66.8 K. The ON-current degradation and TLmax do not only define the device's thermal stability. Therefore, the thermal resistance is obtained by the slope of ΔTLmax and DC power curves, which reflects the low thermal resistance in the multi-nanosheet device. Furthermore, the TLmax of junctionless and inversion mode devices is compared at the same operational power. It is found ~ 100 K lower in junctionless devices due to weak lateral electric field intensity at the channel/drain interface.\",\"PeriodicalId\":281727,\"journal\":{\"name\":\"2022 IEEE International Conference on Emerging Electronics (ICEE)\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Conference on Emerging Electronics (ICEE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEE56203.2022.10117830\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Conference on Emerging Electronics (ICEE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEE56203.2022.10117830","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

利用Sentaurus TCAD仿真工具的三维电热模块,研究了单纳米片到堆叠多纳米片通道的自热效应(SHE)。在无结多纳米片场效应管中观察到不均匀的晶格温度分布。当纳米片由单层堆叠到三层堆叠时,器件性能提高了约5%,但最大晶格温度(TLmax)也提高了约66.8 K。导通电流衰减和TLmax不仅定义了器件的热稳定性。因此,通过ΔTLmax和直流功率曲线的斜率得到热阻,反映了多纳米片器件的低热阻。此外,在相同的工作功率下,比较了无结和反转模式器件的TLmax。在无结器件中,由于沟道/漏极界面处的侧向电场强度较弱,该器件的电导率降低了约100 K。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Self-Heating Effect in Sub-5nm Node Junctionless Multi-Nanosheet FET
In this paper, the self-heating effect (SHE) is investigated in single nanosheet to stacked multi-nanosheet channels using the 3D electrothermal module of the Sentaurus TCAD simulation tool. The non-uniform lattice temperature (TL) distribution is observed in the junctionless multi-nanosheet FET. The device performance is enhanced by ~5% when the nanosheet is stacked from a single to three nanosheets, but the maximum lattice temperature (TLmax) also increases by ~66.8 K. The ON-current degradation and TLmax do not only define the device's thermal stability. Therefore, the thermal resistance is obtained by the slope of ΔTLmax and DC power curves, which reflects the low thermal resistance in the multi-nanosheet device. Furthermore, the TLmax of junctionless and inversion mode devices is compared at the same operational power. It is found ~ 100 K lower in junctionless devices due to weak lateral electric field intensity at the channel/drain interface.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信