Prototype sensor and data acquisition system for the CILAP polymer deposition process

Improved process control is important in reducing the cost of microelectronics fabrication and electronics packaging. The goal of this paper is to present the findings from the design and implementation of a sensor and data acquisition system for an extrusion polymer deposition tool. The developed system will provide a platform for intelligent process control that will automate microelectronics fabrication machines, making them more suitable for assembly line or fabrication lab use. Covered are the construction of the sensor system at Dow and results from coating runs performed while the sensor system was collecting data. Examination of the data revealed several important relationships between the values sensed in real-time and post-process performance measurements. Film thickness is shown to relate to system pressures. Also, temperature effects and physical restraints on the extruder die are shown to significantly affect polymer flow, suggesting a means of actuation for intelligent process control.