单晶硅超快激光损伤的扫描隧道显微分析

Laser Damage Pub Date : 2022-12-02 DOI:10.1117/12.2637432
L. Clink, Zhihan Li, C. Kuz, J. Gupta, E. Chowdhury
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引用次数: 0

摘要

激光加工对于半导体的形貌和能带结构的修饰是非常有用的。利用扫描隧道显微镜(STM)绘制了氢氟酸蚀刻硅(100)在高真空中被1030nm、持续时间为70fs的超快脉冲Yb:KGW激光破坏后周围的形貌和光谱。STM使用原子尖尖端和反馈回路控制的压电晶体来表征具有原子分辨率的导电表面。有了这个,我们观察到了周期性的表面结构。这些信息可以用来更好地理解激光损伤过程,最终可以用来表征没有地形变化的缺陷形成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Scanning tunneling microscopy analysis of ultrafast laser damage of single crystal silicon
Laser processing is useful for topographical and band structure modification of semiconductors. We used a Scanning Tunneling Microscope (STM) to map topography and spectra around hydrofluoric acid etched silicon (100) damaged with an ultrafast pulsed Yb:KGW laser at 1030nm with duration of 70fs in high vacuum. STM uses an atomically sharp tip and feedback loop controlled piezoelectric crystals to characterize conductive surfaces with atomic resolution. With this, we have observed periodic surface structures. This information can then be used to understand the laser damage process better and eventually can be used to characterize defect formation without the presence of topographical change.
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