符合EMC要求的印刷电路板设计挑战

S. Marndi, Niladri Roy
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引用次数: 1

摘要

采用上升和下降时间快的高速信号的趋势、混合信号设计和电子产品小型化的需求增加了印刷电路板设计的重要性。电磁兼容性(EMC)已成为现代军用电子系统设计中的一个关键问题。印刷电路板设计不当会导致产品性能下降、故障和不符合EMC法规。各标准机构制定的电磁兼容导则保证了产品在电磁环境下的可靠性和安全性。本文介绍了在为自主研制的雷达系统设计各种高密度、复杂的印刷电路板时所考虑的各种设计技术,既能减少电磁发射,又能使产品符合电磁兼容要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design Challenges in Printed Circuit Boards for EMC Compliance
The trend of using high speed signals with fast rise and fall time, mixed signal design and demand of compact electronic products has increased the criticality of printed circuit boards design. Electromagnetic Compatibility (EMC) is becoming a crucial issue in design of modern military electronics systems. Improper printed circuit board designs can cause to performance degradation, failure of products and non-compliance with EMC regulations. EMC guidelines set by various standard institutions ensure the reliability and safe operation of the products in an electromagnetic environment. This paper describes various design techniques that has been considered while designing various high density and complex printed circuit boards for Indigenously developed Radar systems, that not only reduces the electromagnetic emissions but also make the products Electromagnetic Compatibility (EMC) compliance.
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