锡晶须:一个案例研究

M.E. McDowell
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引用次数: 24

摘要

纯电镀锡易受纤维晶须生长的影响,从而产生短路,在某些条件下,还会产生能够维持数百安培的真空金属电弧。典型的晶须直径为3-4微米,长度接近2毫米;它们的强度足以穿透一层保形涂层。讨论了锡晶须的物理、电学性质及其生长的原因。提出了现有航天器硬件中锡的处理方法。当生长条件非常不利或镀锡组件被保形涂层时,它允许使用锡。在晶须可能生长并有问题的情况下,需要去除和更换,或仔细清洁和保形涂层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Tin whiskers: a case study
Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circuits and, under some conditions, vacuum metal arcs capable of sustaining hundreds of amps. Typical whiskers are 3-4 mu m in diameter and approach 2 mm in length; they are strong enough to penetrate one layer of conformal coating. The physical and electrical properties of tin whiskers and the reasons for their growth are discussed. A methodology to disposition to use of tin in existing spacecraft hardware is presented. It permits the use of tin when growth conditions are strongly adverse or when the tin-plated components are conformally coated. In cases where whisker growth is considered possible and problematic, removal and replacement, or careful cleaning and conformal coating is required.<>
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