印刷电路板结构分析的有限元建模

Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) Pub Date : 1997-10-26 DOI:10.1109/PEP.1997.656471

M. Lee

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引用次数: 3

摘要

为了更好地进行机械设计，考虑了印刷电路板的不利偏转。在回流过程中，PCB经历了一个介于环境温度和炉温峰值之间的温度范围。由于材料成分的热性能不匹配，产生了面外偏转。研究了板料与镀铜的结合，以查明故障原因，改进设计。由于输入数据的复杂性，忽略了焊接和安装组件重量的影响。一组真实的pcb暴露在回流过程中，并收集了偏转数据进行比较。作为分析过程的一部分，提出了板挠度的有限元模型。

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Finite element modeling of printed circuit board for structural analysis

Printed circuit boards with unfavourable deflection have been considered for better mechanical design. During the reflow process, the PCB has experienced a temperature range between ambient temperature and peak furnace temperature. Out of plane deflection is generated due to the thermal properties mismatch of the material composition. The combination of board materials and copper plating is researched for investigation of the cause of the trouble and for design improvements. The effects of soldering and mounted component weight are ignored due to the input data complexity. A set of real PCBs has been exposed in a reflow process and deflection data is collected for comparison. As part of the analysis procedure, a finite element model for board deflection was proposed.

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Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)

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