具有高k间隔的DMG-GOS无结FinFET的性能分析

Appikatla Phani Kumar, R. Lorenzo
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引用次数: 2

摘要

本文设计了具有高k间隔层的双材料栅极(DMG)栅极氧化物堆(GOS)无结FinFET (JLFinFET),并分析了其纳米级应用性能。首先对掺杂进行优化,然后对功函数进行优化。几种高钾材料被用作栅极氧化物。我们发现,当使用高k材料取代栅极氧化物和间隔剂时,所提出的DMG-GOS JLFinFET的性能在亚阈值摆幅(SS),离子/Ioff和漏极诱导势垒降低(DIBL)方面得到了增强。根据模拟结果,高介电常数的材料具有良好的电学性能。此外,该技术对低功耗应用非常有用。此外,使用高k值的绝缘材料可以提高导通电流,从而增加器件的灵活性。在所有高介电单k间隔剂(Air, Si3N4, HfO2)中,HfO2间隔剂的性能更好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance Analysis of DMG-GOS Junctionless FinFET with high-k Spacer
In this paper, the Dual Material Gate (DMG) Gate Oxide Stack (GOS) Junctionless FinFET (JLFinFET) with high-k spacer is designed and analyzed its performance for nanoscale applications. Initially, the doping is optimized and then after work function. Several high-k materials are utilized as gate oxide. We find that the performance of the proposed DMG-GOS JLFinFET is enhanced in terms of subthreshold swing (SS), Ion/Ioff and Drain induced barrier lowering (DIBL) when high-k materials are utilized to replace gate oxide and spacers. According to the simulation results, materials with high dielectric constants produce favorable electrical properties. Furthermore, this technology is useful for low power applications. Additionally, using an insulation material with a high-k value raises the ON current, which increases the device's flexibility. It has been observed that, among all higher dielectric single-k spacers (Air, Si3N4, HfO2), with HfO2 spacer better performance is achieved.
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