Optimized cooling systems for semiconductor devices

The straightforward air cooling of semiconductor devices has gradually been replaced by methods using liquid coolants, especially water cooling. In the work described, more efficient cooling devices than those already existing for hockey-puck and module type semiconductors are suggested. An existing heat sink made of aluminium nitride for the water-cooling of hockey-puck type semiconductors has been used as a basis for the development of high performance heat sinks for increased heat flux densities. By means of thermal and fluid dynamics simulation tools, the internal geometry has been optimized with regard to improved heat transfer and reduced pressure drop. The simulation results have been confirmed by a number of experiments using various measuring techniques. As an alternative cooling method for semiconductor modules, a modified baseplate comprising a number of fins for direct water cooling has been suggested. For an intelligent temperature management, control algorithms have been developed resulting in a prototype ASIC which has been implemented for testing purposes.