{"title":"多芯片模块仿真方法与技术","authors":"H. Reichl, G. Fotheringham","doi":"10.1109/CMPEUR.1992.218419","DOIUrl":null,"url":null,"abstract":"Concepts of multi-chip modules (MCMs) are discussed and simulation methods for their design are presented. The basic requirements for MCM materials and interconnection technologies are outlined. Signal transmission behavior and thermal problems are considered. A short survey of technologies for multilayers is given.<<ETX>>","PeriodicalId":390273,"journal":{"name":"CompEuro 1992 Proceedings Computer Systems and Software Engineering","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1992-05-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Simulation methods and technologies for multichip modules\",\"authors\":\"H. Reichl, G. Fotheringham\",\"doi\":\"10.1109/CMPEUR.1992.218419\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Concepts of multi-chip modules (MCMs) are discussed and simulation methods for their design are presented. The basic requirements for MCM materials and interconnection technologies are outlined. Signal transmission behavior and thermal problems are considered. A short survey of technologies for multilayers is given.<<ETX>>\",\"PeriodicalId\":390273,\"journal\":{\"name\":\"CompEuro 1992 Proceedings Computer Systems and Software Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-05-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"CompEuro 1992 Proceedings Computer Systems and Software Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CMPEUR.1992.218419\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"CompEuro 1992 Proceedings Computer Systems and Software Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CMPEUR.1992.218419","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Simulation methods and technologies for multichip modules
Concepts of multi-chip modules (MCMs) are discussed and simulation methods for their design are presented. The basic requirements for MCM materials and interconnection technologies are outlined. Signal transmission behavior and thermal problems are considered. A short survey of technologies for multilayers is given.<>
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