多芯片模块仿真方法与技术

CompEuro 1992 Proceedings Computer Systems and Software Engineering Pub Date : 1992-05-04 DOI:10.1109/CMPEUR.1992.218419

H. Reichl, G. Fotheringham

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引用次数: 0

摘要

讨论了多芯片模块的概念，并给出了其设计的仿真方法。概述了MCM材料和互连技术的基本要求。考虑了信号传输行为和热问题。对多层材料的技术作了简要的概述

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Simulation methods and technologies for multichip modules

Concepts of multi-chip modules (MCMs) are discussed and simulation methods for their design are presented. The basic requirements for MCM materials and interconnection technologies are outlined. Signal transmission behavior and thermal problems are considered. A short survey of technologies for multilayers is given.<>

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CompEuro 1992 Proceedings Computer Systems and Software Engineering

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