{"title":"结合射频BIST和机器学习算法的ATM射频接收链生产试验","authors":"S. Darfeuille, C. Kelma","doi":"10.1109/ECCTD.2011.6043628","DOIUrl":null,"url":null,"abstract":"Testing an RF device in Production is expensive and technically difficult. At Wafer Test level, the RF probing technologies hardly fulfil the industrial test requirements in terms of accuracy, reliability and cost. At Package test level testing the RF parameters requires expensive RF equipments (RF automated test equipments (ATE)) and for complex RF transceivers, which address multi-modes (RF multi-paths and/or requiring different impedance matchings), it usually leads to prohibitive test time.","PeriodicalId":126960,"journal":{"name":"2011 20th European Conference on Circuit Theory and Design (ECCTD)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Production test of an RF receiver chain based on ATM combining RF BIST and machine learning algorithm\",\"authors\":\"S. Darfeuille, C. Kelma\",\"doi\":\"10.1109/ECCTD.2011.6043628\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Testing an RF device in Production is expensive and technically difficult. At Wafer Test level, the RF probing technologies hardly fulfil the industrial test requirements in terms of accuracy, reliability and cost. At Package test level testing the RF parameters requires expensive RF equipments (RF automated test equipments (ATE)) and for complex RF transceivers, which address multi-modes (RF multi-paths and/or requiring different impedance matchings), it usually leads to prohibitive test time.\",\"PeriodicalId\":126960,\"journal\":{\"name\":\"2011 20th European Conference on Circuit Theory and Design (ECCTD)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 20th European Conference on Circuit Theory and Design (ECCTD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECCTD.2011.6043628\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 20th European Conference on Circuit Theory and Design (ECCTD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECCTD.2011.6043628","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Production test of an RF receiver chain based on ATM combining RF BIST and machine learning algorithm
Testing an RF device in Production is expensive and technically difficult. At Wafer Test level, the RF probing technologies hardly fulfil the industrial test requirements in terms of accuracy, reliability and cost. At Package test level testing the RF parameters requires expensive RF equipments (RF automated test equipments (ATE)) and for complex RF transceivers, which address multi-modes (RF multi-paths and/or requiring different impedance matchings), it usually leads to prohibitive test time.