用于高压绝缘的纳米二氧化硅填充环氧体系的热学和电学性能

2011 Electrical Insulation Conference (EIC). Pub Date : 2011-06-05 DOI:10.1109/EIC.2011.5996206

M. Reading, Zhiqiang Xu, A. Vaughan, P. Lewin

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引用次数: 16

摘要

由于环氧树脂具有优异的机械、热学和电学性能，在许多应用中已被证明是一种优异的绝缘系统。本文详细研究了微纳米二氧化硅(分别为SD和NSD)填充环氧树脂体系以及由此产生的复合材料的热学和电学性能。研究了填料的添加量及其粒径对DER 332环氧树脂整体性能的影响。采用差示扫描量热法(DSC)和交流击穿等技术对复合材料进行表征，通过击穿变化分析填料对复合材料玻璃化转变温度和均匀性的影响。

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The thermal and electrical properties of nano-silicon dioxide filled epoxy systems for use in high voltage insulation

Epoxy resins have proven to be an excellent insulation system in many application due to their excellent mechanical, thermal and electrical properties. This paper details an investigation into micro and nano silicon dioxide (SD and NSD respectively) filled epoxy systems and the resulting thermal and electrical properties of the composite. The effect of addition of the fillers relative to their particle size on the overall properties of a DER 332 epoxy was investigated. The composites were characterised using techniques such as differential scanning calorimetry (DSC) and AC breakdown to analyse the effect the filler has on the composite materials glass transition temperature and uniformity through breakdown variation.

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2011 Electrical Insulation Conference (EIC).

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