微控制器IO接口EMI失效机制及解决方案

A. Kamath
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引用次数: 1

摘要

本文讨论了微控制器IO接口在大电流注入(BCI)和辐射抗扰度(RI)过程中的不同失效模式。这有助于硬件工程师在设计阶段适当地合并解决方案,从而避免重新设计时间和测试成本。本文展示了BCI如何进入被测设备(DUT)以及如何避免这种情况。同样,它显示了辐射免疫失效是如何发生的。此外,在现有设计中出现故障的情况下,还讨论了逐步排除故障的过程。最后讨论了在PCB设计阶段可以采取的一般注意事项。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
EMI failure mechanism in microcontroller IO interface and solutions
In this paper different failure modes — in a Microcontroller IO interface — during Bulk Current Injection (BCI) and Radiated Immunity (RI) are discussed. This helps the hardware engineer to properly incorporate solutions during the design phase itself so that he can avoid redesign time and testing cost. It shown in the paper how the BCI can enter into the Device Under Test (DUT) and how this can be avoided. Similarly it is shown how Radiated Immunity failure can take place. Further in case there is a failure during existing design, a step by step procedure to trouble shoot is also discussed. Finally this paper discusses general precautions that can be taken in the PCB design stage.
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