基于激光的集成电路缺陷定位

2006 International Electron Devices Meeting Pub Date : 2006-12-01 DOI:10.1109/IEDM.2006.346968

E. Cole

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引用次数: 2

摘要

由于减小了特征尺寸、电路密度和复杂的电刺激，现代集成电路的复杂性呈爆炸式增长，这使得故障分析和缺陷定位变得极其困难。密集的金属化和倒装芯片封装可以只留下IC的背面可用于审讯。基于激光的方法为分析人员提供了一些强大的工具来克服这些障碍

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Laser-Based Defect Localization on Integrated Circuits

The explosion in complexity of modern ICs resulting from reduced feature sizes, circuit density, and sophisticated electrical stimulus has made failure analysis and defect localization extremely difficult. Dense metallization and flip-chip packaging can leave only the backside of the IC available for interrogation. Laser-based methods provide some of the powerful tools analysts depend on to overcome these obstacles

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2006 International Electron Devices Meeting

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