MBE生长高p掺杂In/sub 0.53/Ga/sub 0.47/As:Be接触层的优化

W. Passenberg, P. Harde, H. Kunzel, D. Trommer
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引用次数: 0

摘要

采用分子束外延法,优化了高Be掺杂(10/sup 19/-10/sup 20/ cm/sup -3/) InGaAs JFET器件接触层的生长,使Be扩散最小化。Be扩散系数与Be浓度呈指数关系,与生长温度密切相关。在350 ~ 500℃的生长温度范围内,Ti-Au触点的空穴浓度和比电阻不受生长温度的影响。即使在10/sup 19/ cm/sup -3/范围内,生长温度低至350℃时,InGaAs中的Be掺杂曲线也相当突然。采用这种优化的层结构的jfet表现出接近30 GHz (1 μ m栅极长度)的高传输频率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of extremely highly p-doped In/sub 0.53/Ga/sub 0.47/As:Be contact layers grown by MBE
The growth of extremely highly Be-doped (10/sup 19/-10/sup 20/ cm/sup -3/) InGaAs contact layers for JFET devices by molecular beam epitaxy was optimized with respect to minimizing the Be diffusion. Be diffusion coefficients were found to depend exponentially on Be concentration and strongly on the growth temperature. Hole concentrations and specific resistances of Ti-Au contacts were not influenced by the growth temperature in the investigated range of 350-500 degrees C. Fairly abrupt Be doping profiles in InGaAs were attained at growth temperatures of as low as 350 degrees C even at doping densities in the 10/sup 19/ cm/sup -3/ range. JFETs employing such an optimized layer structure exhibited very high transit frequencies of nearly 30 GHz (1- mu m gate length).<>
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