新一代互联

H. Albrecht, A. Beier, P. Demmer, M. Franke, R. Modinger, K. Pfeiffer, P. Beil, J. Kostelnik, J. Bauer, F. Ebling, H. Schroder, E. Griese
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引用次数: 3

摘要

提出了一种基于印刷电路板的新一代光背板系统互连方案,该方案可在光电收发处理板和光背板上通过集成多模聚合物光波导传输数据。讨论了该系统的不同发展,如光波导技术、发射/接收模块活动和光互连/耦合概念。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New-generation interconnect
A new-generation interconnect for optical backplane systems based on printed circuits board is presented for transmitting data via integrated multimode polymer optical waveguides both on electro-optical transmitter/receiver processing boards and on optical backplane board. Different developments concerning this system such as optical waveguide technology, transmitter/receiver module activities, and optical interconnect/coupling concepts are discussed.
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