使用阻抗谱，扫描电镜和SAM成像早期检测SMT组件的故障

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 1997-07-21 DOI:10.1109/IPFA.1997.638124

Y. Ousten, S. Mejdi, A. Fenech, J. Delétage, L. Béchou, M. Perichaud, Y. Danto

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引用次数: 9

摘要

我们提出了互补的解决方案，以改进PCB在特定应力下的评估，使用适合电路板给定部分的电气和物理指标。对于陶瓷电容器，残余压电在共振时提供阻抗特征，允许检测局部物理缺陷。分析与有限元模拟相结合的方法可以预测热循环下焊点的疲劳临界，而铅相粗化提供了良好的早期退化指标。最后，利用剪切波在扫描声显微镜下检测BGA封装的球体，提高了分辨率。

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The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies

We propose complementary solutions to improve the evaluation of PCB under specific stresses using electrical and physical indicators adapted to a given part of the board. For ceramic capacitors, the residual piezoelectricity provides an impedance signature at resonance allowing detection of local physical defects. Solder joint fatigue criticity under thermal cycle can be predicted using combined analytical and FEM simulations, while the lead phases coarsening provides a good early degradation indicator. At last, ball inspection of BGA packages using shear waves in scanning acoustic microscope lead to an interesting improvement of resolution.

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Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

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