{"title":"逐行控制器在化学-机械平面化工艺中的应用。我","authors":"A. Hu, Z. Zhang, E. Sachs, P. Renteln","doi":"10.1109/IEMT.1993.398197","DOIUrl":null,"url":null,"abstract":"The Run by Run (RbR) controller, combining the advantages both statistical process control (SPC) and automatic process control (APC) has been applied successfully to a technically mature epitaxy processes and is now being applied on the chemical-mechanical planarization (CMP process). Three quality metrics are defined and used as measurements of process improvement. The application procedure is divided into five stages, of which the implementation stages one and two have been performed. The data show that a system can be described by an equilibrium state, a transition period responsive to shifts in the input, but exhibiting substantial hysteresis. A transition period between different equilibrium states is clearly observable. The memory that the pad has due to previous recipe is also clearly demonstrated.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"2016 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Application of Run by Run controller to the chemical-mechanical planarization process. I\",\"authors\":\"A. Hu, Z. Zhang, E. Sachs, P. Renteln\",\"doi\":\"10.1109/IEMT.1993.398197\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Run by Run (RbR) controller, combining the advantages both statistical process control (SPC) and automatic process control (APC) has been applied successfully to a technically mature epitaxy processes and is now being applied on the chemical-mechanical planarization (CMP process). Three quality metrics are defined and used as measurements of process improvement. The application procedure is divided into five stages, of which the implementation stages one and two have been performed. The data show that a system can be described by an equilibrium state, a transition period responsive to shifts in the input, but exhibiting substantial hysteresis. A transition period between different equilibrium states is clearly observable. The memory that the pad has due to previous recipe is also clearly demonstrated.<<ETX>>\",\"PeriodicalId\":206206,\"journal\":{\"name\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"volume\":\"2016 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.398197\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.398197","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16
摘要
RbR (Run - by - Run)控制器结合了统计过程控制(SPC)和自动过程控制(APC)的优点,已成功应用于技术成熟的外延工艺,目前正应用于化学-机械平面化(CMP)工艺。定义了三个质量度量标准,并将其用作过程改进的度量。申请程序分为五个阶段,其中实施阶段一和实施阶段二已经完成。数据表明,系统可以用平衡状态来描述,这是一个响应输入位移的过渡期,但表现出明显的滞后。在不同的平衡状态之间有一个过渡时期,是可以清楚地观察到的。由于之前的配方,pad的内存也被清楚地展示出来。
Application of Run by Run controller to the chemical-mechanical planarization process. I
The Run by Run (RbR) controller, combining the advantages both statistical process control (SPC) and automatic process control (APC) has been applied successfully to a technically mature epitaxy processes and is now being applied on the chemical-mechanical planarization (CMP process). Three quality metrics are defined and used as measurements of process improvement. The application procedure is divided into five stages, of which the implementation stages one and two have been performed. The data show that a system can be described by an equilibrium state, a transition period responsive to shifts in the input, but exhibiting substantial hysteresis. A transition period between different equilibrium states is clearly observable. The memory that the pad has due to previous recipe is also clearly demonstrated.<>