聚焦离子束透射电镜制备薄片过程中矿物的破坏

G. Jeong
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引用次数: 0

摘要

聚焦离子束(FIB)技术广泛应用于精确制备靶区矿物和地质材料透射电子显微镜(TEM)观测所需的薄片。然而,镓离子束和电子束的结构损伤和伪影是TEM分析的主要难点。矿物样品的TEM分析显示石英和长石的非晶化,幕效应和Ga污染,特别是在颗粒边缘和相对较薄的区域。虽然通过调整加速电压和电流等改进方法可以大大减少离子束损伤,但离子束损伤和污染可能是不可避免的,因此需要仔细解释TEM分析观察到的微观结构和微化学特征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Damage of Minerals in the Preparation of Thin Slice Using Focused Ion Beam for Transmission Electron Microscopy
Focused ion beam (FIB) technique is widely used in the precise preparation of thin slices for the transmission electron microscopic (TEM) observation of target area of the minerals and geological materials. However, structural damages and artifacts by the Ga ion beam as well as electron beam damage are major difficulties in the TEM analyses. TEM analyses of the mineral samples showed the amorphization of quartz and feldspar, curtain effect, and Ga contamination, particularly near the grain edges and relatively thin regions. Although the ion beam damage could be much reduced by the improved procedures including the adjustment of the acceleration voltage and current, the ion beam damage and contamination are likely inevitable, thus requiring careful interpretation of the micro-structural and micro-chemical features observed by TEM analyses.
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