DC/DC变换器死区时间变化分析及远场辐射估计

T. Mandic, R. Blečić, R. Gillon, A. Barić
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引用次数: 6

摘要

本文介绍了一种DC/DC变换器的死区时间变化分析和远场辐射估计。确定了影响死区时间变化的关键因素,并确定了它们的统计分布。优化了MOSFET寄生电容的统计分布,使其与测量值相匹配。利用响应面法(RSM)识别封装工艺变化和印刷电路板性能变化,并将其传递到电路模拟器中。在电路模拟器中实现了RSM模型和简化的同步降压DC/DC变换器模型,并进行了蒙特卡罗仿真。从蒙特卡罗模拟结果中提取了死区时间的变化,并确定了最重要的变化源。从仿真结果中提取的开关电流用于估计远场辐射的变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DC/DC converter dead-time variation analysis and far-field radiation estimation
This paper presents the dead-time variation analysis and far-field radiation estimation of a DC/DC converter. The critical factors influencing the dead-time variation are identified and their statistical distributions are defined. The statistical distribution of the MOSFET parasitic capacitances is optimized to match the values obtained by measurements. The packaging process variation together with the variation of the printed circuit board properties are identified and transferred into circuit simulator by the response surface methodology (RSM). The RSM models together with the simplified synchronous buck DC/DC converter model is implemented in circuit simulator and Monte Carlo simulation is performed. The dead-time variation is extracted from Monte Carlo simulation results and most significant sources of variation are identified. The switching current extracted from the simulation results is used to estimate variation of the far-field radiation.
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