单芯片射频前端MMIC解决方案面向未来低成本、小型化、WLAN收发模块应用

C. Yuen, K. Laursen, M. Adams, Due Chu, Hai Nguyen
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引用次数: 5

摘要

介绍了几种用于802.11 b/g和a/b/g应用的高度集成射频前端模块(fem)。在单个4/spl倍/4 mm或5/spl倍/5 mm QFN封装中,这些fem包括线性化功率放大器、低噪声放大器、T/R分集开关、滤波器、双工器、功率检测器以及所有偏置和匹配电路。RF fem用一个封装取代了30多个分立和IC组件,几乎不需要外部组件。它们具有市场上任何802.11 FEM中最小的占地面积,并且通过减少零件数量、简化装配和提高产量,可以在系统级别显著节省成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Single chip RF front-end MMIC solutions for future low cost, miniature size, WLAN transceiver module applications
Several highly integrated RF front-end modules (FEMs) for 802.11 b/g and a/b/g applications are described. In a single 4/spl times/4 mm or 5/spl times/5 mm QFN package, these FEMs include linearized power amplifier(s), a low-noise amplifier, T/R diversity switch, filters, diplexers, power detectors, and all biasing and matching circuitry. The RF FEMs replace over 30 discrete and IC components with a single package, and require practically no external components. They have the smallest footprint of any 802.11 FEM on the market and allow significant cost savings at the system level by reducing parts count, simplifying assembly, and increasing yield.
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