传统MOCVD法研究砷在氮化镓薄膜中的掺入

X. Li, S. Kim, S. G. Bishop, J. Coleman
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引用次数: 1

摘要

只提供摘要形式。本文报道了以AsH/sub - 3/和NH/sub - 3/分别作为As源和N源,采用常压MOCVD技术在GaN薄膜中掺入As。研究了生长温度、生长速率、层厚、单层生长时AsH/sub - 3/和NH/sub - 3/流动比以及多层生长时生长中断对掺入效率的影响。特别令人感兴趣的是在掺杂水平上掺入As。确定了砷在GaN中掺杂的最佳生长条件,在特征发射波长(/spl sim/480 nm)处产生强发光。特征发射归因于As等电子杂质上束缚的激子。用SIMS法测定砷(As)浓度及其深度分布。x射线衍射摇摆曲线证实了掺入砷后的晶体质量。利用室温和低温阴极发光(CL)、光致发光(PL)光谱和成像技术表征了材料的光学性质。结果将与As离子注入GaN进行比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the incorporation of arsenic (As) in GaN films by conventional MOCVD
Summary form only given. We report on the As incorporation in GaN films by atmospheric pressure MOCVD using AsH/sub 3/ and NH/sub 3/ as the As and N sources, respectively. The effect of growth parameters on the incorporation efficiency, including growth temperature, growth rate, layer thickness, ratio of AsH/sub 3/ and NH/sub 3/ flows for single layer growth, and the effect of growth interruption for multilayer growth, have been investigated. Of particular interest is the incorporation of As at a doping level. The optimum growth condition for the doping of As in GaN producing strong luminescence at a characteristic emission wavelength (/spl sim/480 nm) has been identified. The characteristic emission has been attributed to excitons bound at As isoelectronic impurities. Arsenic (As) concentration and its depth distribution are measured by SIMS. The crystal quality after As incorporation is demonstrated by X-ray diffraction rocking curve. Room temperature and low temperature cathodoluminescence (CL), photoluminescence (PL) spectroscopy and imaging are used to characterize the optical properties. Results will be compared with As ion implanted GaN.
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