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引用次数: 0
摘要
随着电子器件需求的不断增长，球栅阵列(BGA)焊点的可靠性、性能和结构已成为人们关注的重要问题。通过剪切试验对BGA的可靠性进行了评价。不同的球剪试验参数会引起应力应变的变化。本文对球栅阵列(BGA)上单焊点在不同剪切速度下的简单剪切试验进行了仿真。在这个分析中使用了Sn-3.5Ag-0.7Cu无铅焊料。采用单因素简单单因素(SSF)实验分析了单因素负载对单个焊锡球的影响。利用ANSYS Version 11对BGA的载荷效应进行了仿真。绘制了负载对BGA单焊点的影响结果。结果表明，高剪切速度试验比低剪切速度试验获得更大的剪切力。
Higher Copper Composition Shear Stress Analysis on Lead Free Solder Ball
The reliability performance and structural of the solder joint on the Ball Grid Array (BGA) has become an important concern, due to increasing demand of electronic devices. The reliability of the BGA are evaluated through shear test. Different parameters of the ball shear test will cause the change on stress and strain. In this paper, a simple shear test on a single solder ball joints on Ball Grid Array (BGA) with varied shear speed was simulated. Lead free solder Sn-3.5Ag-0.7Cu is used in this analysis. Simple Single Factor (SSF) experiment for a single factor was used to analyse the load effect on a single solder ball. Simulation of load effects on BGA was accomplished by using ANSYS Version 11. The results in load effect on the single solder joint of BGA was plotted. Result shows that the high shear speed test obtains greater shear forces compare to low shear speed test.
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