改进了封装多芯片模块的层分配

Proceedings 1992 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems Pub Date : 1992-11-04 DOI:10.1109/DFTVS.1992.224343

C.-H. Chen, M.H. Heydari, I. Tollis, C. Xia

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引用次数: 2

摘要

层分配问题在封装多芯片模块中起着重要的作用，因为层数直接关系到最终产品的成本。本文提出了该问题的一个新模型，并在此基础上提出了一种启发式分层分配算法。实验结果表明，该算法提供的解接近下界。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Improved layer assignment for packaging multichip modules

The layer assignment problem plays an important role in packaging multichip modules, since the number of layers is directly related to the cost of the final product. In this paper, the authors propose a new model for the problem and a heuristic layer assignment algorithm based on the new model. The experimental results presented show that the solution provided by the algorithm is close to the lower bound.<>

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Proceedings 1992 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems

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