{"title":"符合IPC-A-610D的表面安装设备的自动光学检测","authors":"Pedro M. A. Vitoriano, T. Amaral, O. Dias","doi":"10.1109/POWERENG.2011.6036444","DOIUrl":null,"url":null,"abstract":"Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing process. The use of this technology has been proved to be highly efficient on process improvements and quality achievements. The most difficult point on Surface Mounting Devices (SMD) inspection is the solder joint due to their specular reflections. Several studies have been made to improve this situation. In this paper, it is presented a solder joint classification system based on IPC-A-610D (Acceptability of Electronics Assemblies).","PeriodicalId":166144,"journal":{"name":"2011 International Conference on Power Engineering, Energy and Electrical Drives","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance\",\"authors\":\"Pedro M. A. Vitoriano, T. Amaral, O. Dias\",\"doi\":\"10.1109/POWERENG.2011.6036444\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing process. The use of this technology has been proved to be highly efficient on process improvements and quality achievements. The most difficult point on Surface Mounting Devices (SMD) inspection is the solder joint due to their specular reflections. Several studies have been made to improve this situation. In this paper, it is presented a solder joint classification system based on IPC-A-610D (Acceptability of Electronics Assemblies).\",\"PeriodicalId\":166144,\"journal\":{\"name\":\"2011 International Conference on Power Engineering, Energy and Electrical Drives\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 International Conference on Power Engineering, Energy and Electrical Drives\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/POWERENG.2011.6036444\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Conference on Power Engineering, Energy and Electrical Drives","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POWERENG.2011.6036444","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance
Automated Optical Inspection (AOI) Systems are commonly used on Printed Circuit Boards (PCB) manufacturing process. The use of this technology has been proved to be highly efficient on process improvements and quality achievements. The most difficult point on Surface Mounting Devices (SMD) inspection is the solder joint due to their specular reflections. Several studies have been made to improve this situation. In this paper, it is presented a solder joint classification system based on IPC-A-610D (Acceptability of Electronics Assemblies).