Haraka在SPHINCS+中的高吞吐量硬件实现

Yueqin Dai, Yifeng Song, Jing Tian, Zhongfeng Wang
{"title":"Haraka在SPHINCS+中的高吞吐量硬件实现","authors":"Yueqin Dai, Yifeng Song, Jing Tian, Zhongfeng Wang","doi":"10.1109/ISQED57927.2023.10129310","DOIUrl":null,"url":null,"abstract":"SPHINCS+, a hash-based signature scheme, has stood out as one of the four winners in the post-quantum cryptography (PQC) competition hosted by the U.S. National Institute of Standards and Technology (NIST). However, the slow signing speed forms a bottleneck for applications. Therefore, a kind of short-input hash function named Haraka is recommended as the third instantiation in SPHINCS+ due to its advantage in processing speed. In this work, we propose four hardware architecture schemes for Haraka in SPHINCS+, denoted as Case I to Case IV. Several optimization methods are combined and applied in different cases to perform the trade-off between area and throughput for different application scenarios. We code our designs in System Verilog language and synthesize them under the TSMC 28-nm CMOS technology. The experiment results show that Case IV achieves the best throughput and the most efficient performance, about 81.92 Gbps and 1.26 Mbps/GE, respectively, which also significantly outperforms the state-of-the-art implementation of Haraka and the advanced hardware implementation of the SHA-3 hash function.","PeriodicalId":315053,"journal":{"name":"2023 24th International Symposium on Quality Electronic Design (ISQED)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"High-Throughput Hardware Implementation for Haraka in SPHINCS+\",\"authors\":\"Yueqin Dai, Yifeng Song, Jing Tian, Zhongfeng Wang\",\"doi\":\"10.1109/ISQED57927.2023.10129310\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SPHINCS+, a hash-based signature scheme, has stood out as one of the four winners in the post-quantum cryptography (PQC) competition hosted by the U.S. National Institute of Standards and Technology (NIST). However, the slow signing speed forms a bottleneck for applications. Therefore, a kind of short-input hash function named Haraka is recommended as the third instantiation in SPHINCS+ due to its advantage in processing speed. In this work, we propose four hardware architecture schemes for Haraka in SPHINCS+, denoted as Case I to Case IV. Several optimization methods are combined and applied in different cases to perform the trade-off between area and throughput for different application scenarios. We code our designs in System Verilog language and synthesize them under the TSMC 28-nm CMOS technology. The experiment results show that Case IV achieves the best throughput and the most efficient performance, about 81.92 Gbps and 1.26 Mbps/GE, respectively, which also significantly outperforms the state-of-the-art implementation of Haraka and the advanced hardware implementation of the SHA-3 hash function.\",\"PeriodicalId\":315053,\"journal\":{\"name\":\"2023 24th International Symposium on Quality Electronic Design (ISQED)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-04-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 24th International Symposium on Quality Electronic Design (ISQED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED57927.2023.10129310\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 24th International Symposium on Quality Electronic Design (ISQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED57927.2023.10129310","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

在由美国国家标准与技术研究院(NIST)主办的后量子密码学(PQC)竞赛中,基于哈希的签名方案SPHINCS+脱颖而出,成为四个获胜者之一。但是,缓慢的签名速度会成为应用程序的瓶颈。因此,由于在处理速度上的优势,推荐使用一种名为Haraka的短输入哈希函数作为SPHINCS+中的第三个实例化。在这项工作中,我们为SPHINCS+中的Haraka提出了四种硬件架构方案,分别为Case I到Case IV。在不同的情况下,我们结合了几种优化方法,以在不同的应用场景下实现面积和吞吐量之间的权衡。我们用System Verilog语言进行编码,并在台积电28纳米CMOS技术下进行合成。实验结果表明,Case IV实现了最好的吞吐量和最有效的性能,分别约为81.92 Gbps和1.26 Mbps/GE,这也显著优于Haraka的最先进实现和SHA-3哈希函数的先进硬件实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-Throughput Hardware Implementation for Haraka in SPHINCS+
SPHINCS+, a hash-based signature scheme, has stood out as one of the four winners in the post-quantum cryptography (PQC) competition hosted by the U.S. National Institute of Standards and Technology (NIST). However, the slow signing speed forms a bottleneck for applications. Therefore, a kind of short-input hash function named Haraka is recommended as the third instantiation in SPHINCS+ due to its advantage in processing speed. In this work, we propose four hardware architecture schemes for Haraka in SPHINCS+, denoted as Case I to Case IV. Several optimization methods are combined and applied in different cases to perform the trade-off between area and throughput for different application scenarios. We code our designs in System Verilog language and synthesize them under the TSMC 28-nm CMOS technology. The experiment results show that Case IV achieves the best throughput and the most efficient performance, about 81.92 Gbps and 1.26 Mbps/GE, respectively, which also significantly outperforms the state-of-the-art implementation of Haraka and the advanced hardware implementation of the SHA-3 hash function.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信