用于mmic晶圆级集成的亚太赫兹微机械波导

2017 12th European Microwave Integrated Circuits Conference (EuMIC) Pub Date : 1900-01-01 DOI:10.23919/eumc.2017.8231029

P. Pursula, A. Lamminen, M. Kantanen, J. Saarilahti, V. Ermolov

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引用次数: 1

摘要

我们展示了基于硅微机械波导的亚太赫兹集成系统的第一个结果。演示的270 GHz组件包括波导、滤波器和过孔，以及波导和MMIC之间的低损耗转换。开发的工艺依赖于众所周知的MEMS制造方法和硅晶圆衬底，为未来的通信和传感应用提供了可扩展和经济高效的系统集成方法。

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Sub-THz micromachined waveguides for wafer level integration of MMICs

We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include waveguides, filters and vias, as well as a loss-low transition between the waveguide and the MMIC. The developed process relies on well known MEMS manufacturing methods and Silicon wafer substrates, promising scalable and cost efficient system integration method for future communication and sensing applications.

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2017 12th European Microwave Integrated Circuits Conference (EuMIC)

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