基于低成本串联馈电贴片天线阵列的5gbaud数据传输146.7 GHz收发器

2020 IEEE Radio and Wireless Symposium (RWS) Pub Date : 2020-01-01 DOI:10.1109/RWS45077.2020.9049978

A. Simsek, Seong-Kyun Kim, M. Abdelghany, Ahmed S. H. Ahmed, A. Farid, Upamanyu Madhow, M. Rodwell

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引用次数: 10

摘要

我们提出了一个全封装的双通道发射器和一个全封装的四通道接收器，使用先前报道的四通道收发器，设计在45纳米CMOS SOI中。我们首先提出了一种低成本的天线和封装技术来集成收发器。在Isola Astra MT77 (${\mathcal{E}_r} = 3$， tanℽ=0.0017)印刷电路板(PCB)上制备的8元串联馈电线性微带贴片天线阵列显示出13.6 dB增益、9°E面和65°h面3-dB波束宽度和7 GHz带宽(S21)，接近仿真结果。这些天线通过线键连接到CMOS多通道发射器和接收器ic上。该界面的模拟预测了ic -天线球键(直径20 μm，长度250 μm)的1.8 dB损耗和键垫与天线馈电点之间的~1.5 mm PCB微带线的0.7 dB损耗。利用这些发射和接收板的一个通道，我们演示了在146.7 GHz载波频率下，在25厘米空气中以3 × 10-5的误码率(BER)和19 dB的信噪比(SNR)传输5gbaud BPSK无线数据。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A 146.7 GHz Transceiver with 5 GBaud Data Transmission using a Low-Cost Series-Fed Patch Antenna Array through Wirebonding Integration

We present a fully-packaged two-channel transmitter and a fully-packaged four-channel receiver using previously reported four-channel transceivers, designed in 45 nm CMOS SOI. We first present a low -cost antenna and packaging technologies to integrate with the transceivers. 8-element series-fed linear microstrip patch antenna arrays fabricated on an Isola Astra MT77 (${\mathcal{E}_r} = 3$, tanℽ=0.0017) printed circuit board (PCB) showed 13.6 dB gain, 9° E- plane and 65° H-plane 3-dB beam-widths, and 7 GHz bandwidth (S21), close to simulation. These antennas are connected to CMOS multi-channel transmitter and receiver ICs through wirebonding. Simulations of this interface predict 1.8 dB loss in the IC-antenna ball-bonds (20 μm diameter, 250 μm length) and 0.7 dB loss in the ~1.5 mm PCB microstrip line between the bond pads and the antenna feed point. Using one channel of these transmitter and receiver boards, we demonstrate 5 GBaud BPSK wireless data transmission over 25 cm air with 3x10-5 bit-error- rate (BER) and 19 dB signal - to-noise-ratio (SNR) at 146.7 GHz carrier frequency.

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来源期刊

2020 IEEE Radio and Wireless Symposium (RWS)

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