{"title":"基于MEMS应用的压电薄膜电学和机电特性研究","authors":"S. Tiedke, K. Prume, T. Schmitz-Kempen","doi":"10.1109/ISAF.2007.4393376","DOIUrl":null,"url":null,"abstract":"The electrical and electromechanical properties of piezoelectric thin films were measured using different measurement procedures including a new method which combines the measurement of both the effective longitudinal and transverse piezoelectric coefficients on the same sample under precisely defined homogeneous mechanical strain utilizing a 4-point bending setup. Stress and corresponding strain distributions in the film were verified by finite element simulations.","PeriodicalId":321007,"journal":{"name":"2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electrical and electromechanical characterization of piezoelectric thin films in view of MEMS application\",\"authors\":\"S. Tiedke, K. Prume, T. Schmitz-Kempen\",\"doi\":\"10.1109/ISAF.2007.4393376\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The electrical and electromechanical properties of piezoelectric thin films were measured using different measurement procedures including a new method which combines the measurement of both the effective longitudinal and transverse piezoelectric coefficients on the same sample under precisely defined homogeneous mechanical strain utilizing a 4-point bending setup. Stress and corresponding strain distributions in the film were verified by finite element simulations.\",\"PeriodicalId\":321007,\"journal\":{\"name\":\"2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-05-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAF.2007.4393376\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAF.2007.4393376","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrical and electromechanical characterization of piezoelectric thin films in view of MEMS application
The electrical and electromechanical properties of piezoelectric thin films were measured using different measurement procedures including a new method which combines the measurement of both the effective longitudinal and transverse piezoelectric coefficients on the same sample under precisely defined homogeneous mechanical strain utilizing a 4-point bending setup. Stress and corresponding strain distributions in the film were verified by finite element simulations.