低技术节点的扫描方法和ATPG DFT技术

Janki K Chauhan, Chintan Panchal, Haresh A. Suthar
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引用次数: 6

摘要

随着VLSI技术不断缩小到较低的技术节点,我们需要有效的技术来测试较低的节点,因为随着设计复杂性的增长,有许多挑战,包括更高的测试成本,更高的功耗,测试时间,面积,引脚数和小几何形状的新缺陷(晶体管通道长度的变化,W/L比,阈值电压)。可靠性和可测试性都是当今超大规模集成电路设计的重要参数。为此目的,我们使用可测试性设计。扫描是在任何芯片中插入DFT(可测试性设计)架构的第一步。因此,扫描插入提高了顺序差错的可控性和可观察性。然后是由ATPG(自动测试模式生成)工具生成的模式生成步骤,最后是模式模拟,将给出通过/失败模式的结果。本文的目的是在底层技术节点上实现扫描插入流架构,并通过ATPG生成模式来检测目标故障,从而通过使用一些EDA工具进行故障检测来提高SOC的成品率。它还包括与可测试性相关的最重要测试参数的优化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Scan methodology and ATPG DFT techniques at lower technology node
As VLSI Technology is continuously shrinking to lower technology nodes, we need efficient techniques for testing on lower nodes because as Design Complexity grows, there are numbers of challenges including higher test cost, higher power consumption, test time, area, pin count and new defects at small geometries(variation in transistor's channel length, W/L ratio, threshold voltage). Reliability and testability both are the important parameters in today's VLSI design. We use design for testability for this purpose. Scan is the first step for inserting DFT(design for testability) architecture in any chip. Thus scan insertion improves the controllability and observability of the sequentially flops. After that pattern generation step is there which is generated by ATPG (Automatic test pattern generation) Tool and finally pattern simulation will give results in terms of pass/fail patterns. The purpose of this paper is to implement scan insertion flow architecture on lower technology nodes and detect the targeted faults through the pattern generation by ATPG which will improve the yield on SOC by fault detection using some EDA tools. It also includes the optimization of the most important test parameters related to testability.
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