用于容错信号和数据处理的晶圆级大规模并行计算模块

[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems Pub Date : 1991-11-18 DOI:10.1109/DFTVS.1991.199940

R. Lea

{"title":"用于容错信号和数据处理的晶圆级大规模并行计算模块","authors":"R. Lea","doi":"10.1109/DFTVS.1991.199940","DOIUrl":null,"url":null,"abstract":"A WASP device is a WSI implementation of an ASP (Associative String Processor) substring and, as such, it constitutes a fundamental building block for the assembly of SIMD Massively Parallel Computer (MPC) components. This paper describes current progress in the WASP 3/4/5 programme.<<ETX>>","PeriodicalId":440536,"journal":{"name":"[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Wafer-scale massively parallel computing modules for fault-tolerant signal and data processing\",\"authors\":\"R. Lea\",\"doi\":\"10.1109/DFTVS.1991.199940\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A WASP device is a WSI implementation of an ASP (Associative String Processor) substring and, as such, it constitutes a fundamental building block for the assembly of SIMD Massively Parallel Computer (MPC) components. This paper describes current progress in the WASP 3/4/5 programme.<<ETX>>\",\"PeriodicalId\":440536,\"journal\":{\"name\":\"[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-11-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DFTVS.1991.199940\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFTVS.1991.199940","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

WASP设备是ASP(关联字符串处理器)子串的WSI实现，因此，它构成了SIMD大规模并行计算机(MPC)组件组装的基本构建块。本文描述了WASP 3/4/5计划的最新进展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Wafer-scale massively parallel computing modules for fault-tolerant signal and data processing

A WASP device is a WSI implementation of an ASP (Associative String Processor) substring and, as such, it constitutes a fundamental building block for the assembly of SIMD Massively Parallel Computer (MPC) components. This paper describes current progress in the WASP 3/4/5 programme.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems

自引率

0.00%

发文量