多层印刷电路板的通孔共振分析

Xinxin Tian, Y. Zhang
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引用次数: 2

摘要

本文从多层印刷电路板上的过孔走线模型出发,通过数值模拟和理论计算,研究了由过孔短段和周围短路过孔引起的过孔共振效应。研究发现,通孔短段会显著降低通孔过渡的电性能,缩短通孔短段可以消除短段共振。当信号通孔被短路通孔包围时,垂直方向的信号电流流过中心信号通孔会激发圆波导谐振器的谐振模式,也会产生通孔谐振。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of via resonance in multi-layer printed circuit board
Via resonance effects which are caused by via stub and surrounding shorting vias are investigated in this paper by numerical simulation and theoretical calculation from a via-trace model on multilayer printed circuit boards. It is discovered that via stub can significantly worsen electric performance of the via transition and stub resonance can be eliminated by shortening via stub. For the case of a signal via surrounded by shorting vias, the vertical signal current flowing on the central signal via can excites resonant mode of circular waveguide resonator, which also generate via resonance.
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