SAW应答器的高温封装

R. Fachberger, J. Bardong
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引用次数: 1

摘要

研究了一种用于恶劣环境下射频应答器的表面声波器件的高温稳定封装方法。对几种陶瓷胶粘剂进行了模具粘接测试和表征。采用有限元法计算了期望热应力。将试样热老化至850°C后,通过剪切试验测量粘接力。在高达650°C的现场温度下,测试了全功能Kovar基外壳的适用性,该外壳带有陶瓷或金属密封,并配备了langasite装置。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High temperature packaging for SAW transponder
A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.
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