{"title":"一种用于低压系统的低功率高密度双边触发触发器","authors":"S. Tiwari, Kunwar Singh, Maneesha Gupta","doi":"10.1109/ARTCOM.2010.64","DOIUrl":null,"url":null,"abstract":"The paper introduces a new low power, high density double edge triggered, (DET) flip-flop. The proposed DET flip-flop is implemented using lesser number of transistors as compared to other state of the art double edge triggered flip-flops designs. Simulation at 250MHz frequency using 180nm/1.8V CMOS technology with BSIM 3v3 parameters, the proposed design shows an improvement of upto 58.63%, 55.7% and 39.9% in terms of power dissipation, power delay product and total transistor width respectively. At scaled voltages, the power consumption of the proposed design reduces by 34% and hence the design is suitable for low power, low voltage and high density applications.","PeriodicalId":398854,"journal":{"name":"2010 International Conference on Advances in Recent Technologies in Communication and Computing","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A Low Power High Density Double Edge Triggered Flip Flop for Low Voltage Systems\",\"authors\":\"S. Tiwari, Kunwar Singh, Maneesha Gupta\",\"doi\":\"10.1109/ARTCOM.2010.64\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper introduces a new low power, high density double edge triggered, (DET) flip-flop. The proposed DET flip-flop is implemented using lesser number of transistors as compared to other state of the art double edge triggered flip-flops designs. Simulation at 250MHz frequency using 180nm/1.8V CMOS technology with BSIM 3v3 parameters, the proposed design shows an improvement of upto 58.63%, 55.7% and 39.9% in terms of power dissipation, power delay product and total transistor width respectively. At scaled voltages, the power consumption of the proposed design reduces by 34% and hence the design is suitable for low power, low voltage and high density applications.\",\"PeriodicalId\":398854,\"journal\":{\"name\":\"2010 International Conference on Advances in Recent Technologies in Communication and Computing\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-10-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 International Conference on Advances in Recent Technologies in Communication and Computing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ARTCOM.2010.64\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 International Conference on Advances in Recent Technologies in Communication and Computing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARTCOM.2010.64","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Low Power High Density Double Edge Triggered Flip Flop for Low Voltage Systems
The paper introduces a new low power, high density double edge triggered, (DET) flip-flop. The proposed DET flip-flop is implemented using lesser number of transistors as compared to other state of the art double edge triggered flip-flops designs. Simulation at 250MHz frequency using 180nm/1.8V CMOS technology with BSIM 3v3 parameters, the proposed design shows an improvement of upto 58.63%, 55.7% and 39.9% in terms of power dissipation, power delay product and total transistor width respectively. At scaled voltages, the power consumption of the proposed design reduces by 34% and hence the design is suitable for low power, low voltage and high density applications.