S. Shinohara, T. Suzuki, K. Tanino, H. Kobayashi, Y. Hasegawa
{"title":"一种针对高频应用的新型低轮廓功率模块","authors":"S. Shinohara, T. Suzuki, K. Tanino, H. Kobayashi, Y. Hasegawa","doi":"10.1109/ISPSD.1996.509507","DOIUrl":null,"url":null,"abstract":"A new 8 mm-profile power module for high-frequency applications is described. This module exhibits low inductances of less than 4 nH for the terminals and a low thermal resistance of 0.234/spl deg/W/cm/sup 2/, providing less assembly time by using a unique double-layered and terminal-integrated AlN substrate. Paralleled MOSFETs in this module demonstrate 500 V-50 A switching at 10 MHz.","PeriodicalId":377997,"journal":{"name":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A novel low-profile power module aimed at high-frequency applications\",\"authors\":\"S. Shinohara, T. Suzuki, K. Tanino, H. Kobayashi, Y. Hasegawa\",\"doi\":\"10.1109/ISPSD.1996.509507\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new 8 mm-profile power module for high-frequency applications is described. This module exhibits low inductances of less than 4 nH for the terminals and a low thermal resistance of 0.234/spl deg/W/cm/sup 2/, providing less assembly time by using a unique double-layered and terminal-integrated AlN substrate. Paralleled MOSFETs in this module demonstrate 500 V-50 A switching at 10 MHz.\",\"PeriodicalId\":377997,\"journal\":{\"name\":\"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.1996.509507\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1996.509507","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A novel low-profile power module aimed at high-frequency applications
A new 8 mm-profile power module for high-frequency applications is described. This module exhibits low inductances of less than 4 nH for the terminals and a low thermal resistance of 0.234/spl deg/W/cm/sup 2/, providing less assembly time by using a unique double-layered and terminal-integrated AlN substrate. Paralleled MOSFETs in this module demonstrate 500 V-50 A switching at 10 MHz.