单片集成垂直IGBT和智能保护电路

Z. Shen, S. P. Robb
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引用次数: 11

摘要

在本文中,我们开发了一种新的智能离散技术,通过在传统的IGBT工艺中添加p井步进,将高压垂直IGBT与低压NMOS保护电路单片集成。首次报道了两种基于相同技术但采用不同保护方案的新型600v智能igbt。第一款智能IGBT提供过流和过温保护。第二种智能IGBT通过感应集电极电压提供防止短路条件的保护。典型观察到的智能IGBT的特性包括在电流密度为100 a /cm/sup /时的正向电压为1.4 V,关断下降时间为200 ns,在125/spl度/C时的短路耐受时间超过50 /spl mu/s。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Monolithic integration of the vertical IGBT and intelligent protection circuits
In this paper, we have developed a new smart discrete technology to monolithically integrate the high voltage vertical IGBT with low-voltage NMOS protection circuitry by adding a p-well step to the conventional IGBT process. Two new 600 V intelligent IGBTs, based on the same technology but using different protection schemes, are reported for the first time. The first intelligent IGBT provides protection against over-current and over-temperature conditions. The second intelligent IGBT provides protection against short circuit conditions by means of sensing collector voltage. The typically observed characteristics of the intelligent IGBT's include a forward voltage of 1.4 V at a current density of 100 A/cm/sup 2/, a turn-off fall time of 200 ns, and a short-circuit withstand time at 125/spl deg/C of more than 50 /spl mu/s.
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