基于电-热-力耦合分析的电力设备劣化可靠性评估

2008 Second International Conference on Thermal Issues in Emerging Technologies Pub Date : 2008-12-01 DOI:10.1115/1.4002451

T. Anzawa, Qiang Yu, M. Yamagiwa, T. Shibutani, M. Shiratori

{"title":"基于电-热-力耦合分析的电力设备劣化可靠性评估","authors":"T. Anzawa, Qiang Yu, M. Yamagiwa, T. Shibutani, M. Shiratori","doi":"10.1115/1.4002451","DOIUrl":null,"url":null,"abstract":"This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise in temperature. Fatigue crack initiates under Al bonding wire for the IGBT module. Crack propagation induces the change in thermal properties of power devices. Total fatigue life changes with configuration of model.","PeriodicalId":414963,"journal":{"name":"2008 Second International Conference on Thermal Issues in Emerging Technologies","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":"{\"title\":\"Reliability evaluation on deterioration of power device using coupled electrical-thermal-mechanical analysis\",\"authors\":\"T. Anzawa, Qiang Yu, M. Yamagiwa, T. Shibutani, M. Shiratori\",\"doi\":\"10.1115/1.4002451\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise in temperature. Fatigue crack initiates under Al bonding wire for the IGBT module. Crack propagation induces the change in thermal properties of power devices. Total fatigue life changes with configuration of model.\",\"PeriodicalId\":414963,\"journal\":{\"name\":\"2008 Second International Conference on Thermal Issues in Emerging Technologies\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"17\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 Second International Conference on Thermal Issues in Emerging Technologies\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4002451\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 Second International Conference on Thermal Issues in Emerging Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.4002451","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 17

摘要

提出了一种评估电源模块热疲劳寿命的基本方法。通过电-热耦合分析，得到了由电流引起的温度分布。然后进行热-力学分析，计算焊点产生的非弹性应变范围。采用裂纹路径模拟技术对总疲劳寿命和温升进行了计算。IGBT模块的铝焊线下产生疲劳裂纹。裂纹扩展引起了功率器件热性能的变化。总疲劳寿命随模型结构的变化而变化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Reliability evaluation on deterioration of power device using coupled electrical-thermal-mechanical analysis

This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise in temperature. Fatigue crack initiates under Al bonding wire for the IGBT module. Crack propagation induces the change in thermal properties of power devices. Total fatigue life changes with configuration of model.

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2008 Second International Conference on Thermal Issues in Emerging Technologies

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