{"title":"50-60 GHz波导到LTCC上的微带转换，以实现集成的MMIC封装","authors":"Kinjal Parmar, Shailendra Singh","doi":"10.1109/IMARC.2016.7939620","DOIUrl":null,"url":null,"abstract":"This paper reports the design of 50–60 GHz probe type waveguide to microstrip transition on LTCC substrate, which acts as an initial development towards integrated MMIC hermetic packaging in millimeter-wave systems. The transition shows a simulated return loss better than 15 dB and insertion loss less than 0.4 dB in back to back configuration. The measured insertion loss is 1.2 to 1.8 dB with return loss bettering 12 dB in the range of 50–60 GHz.","PeriodicalId":341661,"journal":{"name":"2016 IEEE MTT-S International Microwave and RF Conference (IMaRC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"50–60 GHz waveguide to microstrip transition on LTCC for enabling integrated MMIC packaging\",\"authors\":\"Kinjal Parmar, Shailendra Singh\",\"doi\":\"10.1109/IMARC.2016.7939620\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports the design of 50–60 GHz probe type waveguide to microstrip transition on LTCC substrate, which acts as an initial development towards integrated MMIC hermetic packaging in millimeter-wave systems. The transition shows a simulated return loss better than 15 dB and insertion loss less than 0.4 dB in back to back configuration. The measured insertion loss is 1.2 to 1.8 dB with return loss bettering 12 dB in the range of 50–60 GHz.\",\"PeriodicalId\":341661,\"journal\":{\"name\":\"2016 IEEE MTT-S International Microwave and RF Conference (IMaRC)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE MTT-S International Microwave and RF Conference (IMaRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMARC.2016.7939620\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE MTT-S International Microwave and RF Conference (IMaRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMARC.2016.7939620","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
50–60 GHz waveguide to microstrip transition on LTCC for enabling integrated MMIC packaging
This paper reports the design of 50–60 GHz probe type waveguide to microstrip transition on LTCC substrate, which acts as an initial development towards integrated MMIC hermetic packaging in millimeter-wave systems. The transition shows a simulated return loss better than 15 dB and insertion loss less than 0.4 dB in back to back configuration. The measured insertion loss is 1.2 to 1.8 dB with return loss bettering 12 dB in the range of 50–60 GHz.
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