毫米波RF-MEMS SPDT交换网络中的SiGe BiCMOS工艺技术

S. Reyaz, C. Samuelsson, R. Malmqvist, M. Kaynak, A. Rydberg
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引用次数: 9

摘要

本文介绍了基于毫米波电容式RF-MEMS的单极双掷(SPDT)开关,该开关采用SiGe BiCMOS工艺技术制造。三种不同的基于SiGe RF-MEMS的spdt(目标40-80 GHz范围)分别具有3-4 dB的带内损耗和高达20-25 dB的隔离度。当去除射频衬垫内接近1 dB的综合损耗时,表征SiGe MEMS spdt的测量带内衰减对应于2-3 dB的损耗。实验s参数数据来自300多个表征SPDT开关网络的rf测试,表明所制备的SiGe MEMS电路具有较高的制造成品率和工艺可重复性。经过验证的SiGe MEMS开关电路可以使单芯片可重构ic用于高达100 GHz的无线通信和传感应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Millimeter-wave RF-MEMS SPDT switch networks in a SiGe BiCMOS process technology
This paper presents mm-wave capacitive RF-MEMS based Single-Pole-Double-Throw (SPDT) switches fabricated in a SiGe BiCMOS process technology. Three different SiGe RF-MEMS based SPDTs (targeting the 40-80 GHz range) present 3-4 dB of in-band losses and up to 20-25 dB of isolation, respectively. The measured in-band attenuation of the characterized SiGe MEMS SPDTs corresponds to a loss of 2-3 dB when close to 1 dB of combined losses within the RF pads has been removed. The experimental s-parameter data was obtained from RF-tests of more than 300 characterized SPDT switch networks indicating a high fabrication yield and process repeatability of the fabricated SiGe MEMS circuits. The validated SiGe MEMS switch circuits can enable single-chip reconfigurable ICs for wireless communication and sensing applications up to 100 GHz.
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