下一代多千兆串行协议的高速I/O测试电缆组装接口

2009 International Test Conference Pub Date : 2009-12-18 DOI:10.1109/TEST.2009.5355810

Jim Vana, Alexander Barr, Richard Scherer, A. Joshi

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引用次数: 2

摘要

这张海报描述了下一代多千兆串行协议的高速I/O测试电缆接口，如包含3M™屏蔽控制阻抗(SCI)连接器系统的PCI-Express，弹簧探头板接口和低损耗双轴电缆组件，性能高达12 Gbps。

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High Speed I/O Test Cable Assembly Interfaces for Next Generation Multi-Gigabit Serial Protocols

This poster describes High Speed I/O Test Cable Interfaces for Next Generation Multi-Gigabit Serial Protocols such as PCI-Express incorporating 3M™ Shielded Controlled Impedance ( SCI ) Connector Systems, Spring Probe board interfaces and low loss Twinaxial Cable Assemblies with performance capabilities up to 12 Gbps.

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来源期刊

2009 International Test Conference

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