{"title":"碱溶液中硅蚀刻过程中醇类添加剂的吸附分析","authors":"I. Zubel, Małgorzata Kramkowska","doi":"10.1117/12.517059","DOIUrl":null,"url":null,"abstract":"The effect of alcohol additives on silicon anisotropic etching process in KOH solutions has been analysed. It has been stated that the additives modify the anisotropy of the etching process, which results in reduction of etch rates of some crystal planes with specific configuration of surfacial bonds. After considering the bonds configuration on these planes and alcohol molecules dimensions it has been stated that the effective blocking of these planes is directly related to their spatial structure and the structure of alcohol molecule. Obtained results should enable deliberate selection of the additives to etching solutions and the choice of solutions compositions, assuring possible small undercut of convex corners.","PeriodicalId":405495,"journal":{"name":"Optoelectronic and Electronic Sensors","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Analysis of adsorption of alcohol additives in the process of silicon etching in alkaline solutions\",\"authors\":\"I. Zubel, Małgorzata Kramkowska\",\"doi\":\"10.1117/12.517059\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The effect of alcohol additives on silicon anisotropic etching process in KOH solutions has been analysed. It has been stated that the additives modify the anisotropy of the etching process, which results in reduction of etch rates of some crystal planes with specific configuration of surfacial bonds. After considering the bonds configuration on these planes and alcohol molecules dimensions it has been stated that the effective blocking of these planes is directly related to their spatial structure and the structure of alcohol molecule. Obtained results should enable deliberate selection of the additives to etching solutions and the choice of solutions compositions, assuring possible small undercut of convex corners.\",\"PeriodicalId\":405495,\"journal\":{\"name\":\"Optoelectronic and Electronic Sensors\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-09-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optoelectronic and Electronic Sensors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.517059\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optoelectronic and Electronic Sensors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.517059","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of adsorption of alcohol additives in the process of silicon etching in alkaline solutions
The effect of alcohol additives on silicon anisotropic etching process in KOH solutions has been analysed. It has been stated that the additives modify the anisotropy of the etching process, which results in reduction of etch rates of some crystal planes with specific configuration of surfacial bonds. After considering the bonds configuration on these planes and alcohol molecules dimensions it has been stated that the effective blocking of these planes is directly related to their spatial structure and the structure of alcohol molecule. Obtained results should enable deliberate selection of the additives to etching solutions and the choice of solutions compositions, assuring possible small undercut of convex corners.
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