片上/封装集成天线,用于毫米波介质和远程应用

L. Dussopt, José A. Zevallos Luna, A. Siligaris
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引用次数: 4

摘要

提出了一种新型的具有成本效益的毫米波多gbps无线通信天线解决方案,该方案在固定视距(LOS)配置下工作范围超过10-20米。第一天线元件与CMOS-SOI 60 ghz收发器电路集成在片上,以便前端电路和天线之间的互连损耗最小。该天线与嵌入在标准QFN封装中的外部辐射元件耦合,使辐射增益提高到4-6 dBi。最后,在封装的收发器上方放置一个由标准层压板材料制成的离散透镜天线阵列,以聚焦辐射光束并获得超过14 dBi的增益。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On-chip/in-package integrated antenna for millimeter-wave medium and long-range applications
A novel cost-efficient antenna solution for millimeter-wave multi-Gbps wireless communications operating over ranges above 10-20 meters in fixed Line-Of-Sight (LOS) configuration is presented. A first antenna element is integrated on-chip with a CMOS-SOI 60-GHz transceiver circuit in order to benefit from minimum interconnection losses between the front-end circuit and the antenna. This antenna is coupled to an external radiating element embedded in a standard QFN package, enabling an improved radiation gain of 4-6 dBi. Finally, a discrete-lens antenna array fabricated on standard laminate materials is placed above the packaged transceiver in order to focus the radiated beam and reach a gain in excess of 14 dBi.
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